Server Blade Hardware White Papers

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Cisco Interconnect Solutions for HP BladeSystem c-Class
sponsored by Hewlett Packard Enterprise
WHITE PAPER: The latest switch technology allows you to cut down on the amount of physical assets, reduce problem resolution times and ensure information security and regulatory compliance in the data center.
Posted: 29 Jun 2007 | Published: 01 Jun 2007

Hewlett Packard Enterprise

Cisco Unified Computing System Blade Server Chassis Power Modes
sponsored by Cisco Systems, Inc.
WHITE PAPER: The Cisco UCS power configuration approach enables users to meet their redundancy and power density needs. The approach is simple yet flexible enough to adapt to the varying needs for different applications within the data center. Continue reading to learn more.
Posted: 14 Feb 2011 | Published: 01 Oct 2010

Cisco Systems, Inc.

RAID 50 Interleave White Paper
sponsored by Xtore
WHITE PAPER: Improve RAID performance, lower the likelihood of critical drive failure and rebuild faster. Read this white paper and learn how to develop a truly Automated Tiered Storage Solution.
Posted: 01 Jan 2007 | Published: 01 Dec 2006

Xtore

Rack Powering Options for High Density
sponsored by Schneider Electric
WHITE PAPER: In this APC whitepaper, alternatives for providing electrical power to high density racks in data centers and network rooms are explained and compared as well as defined guidelines for rack power systems that can reliably deliver power to high density loads while adapting to changing needs.
Posted: 01 Apr 2010 | Published: 09 Jul 2009

Schneider Electric

IBM System X Family Brochure - IBM System x rack and tower servers
sponsored by IBM and Intel
WHITE PAPER: If you’re looking for ways to create a dynamic infrastructure, look no further. This brochure shows how IBM System x and BladeCenter servers help to deliver an infrastructure that reduces operating costs, manages present and future risk, and improves services.
Posted: 07 Jun 2011 | Published: 07 Jun 2011

IBM and Intel

Sun Blade 6000 Modular System from Oracle
sponsored by Oracle Corporation
WHITE PAPER: The Sun Blade 6000 Modular Systems present a comprehensive multitier blade portfolio that lets organizations deploy the broadest range of applications on the most ideal platforms. This document describes the Sun Blade 6000 Modular Systems along with their key applications, architecture, and components.
Posted: 15 Mar 2011 | Published: 01 Jan 2010

Oracle Corporation

Managing Today's Data Centers: Avoiding the Impending Crisis
sponsored by Aperture - An Emerson Network Brand
WHITE PAPER: High-density equipment has created significant benefits for organizations. However, there are challenges with high-density that could negatively impact organizations. Download this paper for a look at challenges and key issues facing organizations.
Posted: 16 May 2007 | Published: 01 May 2007

Aperture - An Emerson Network Brand

Total cost of ownership (TCO) of Dell PowerEdge M710 and HP Proliant BL685c G5 blade solutions
sponsored by Dell, Inc. and Intel®
WHITE PAPER: Enterprises of all sizes are deploying or considering deploying blade systems as a way to consolidate resources and lower their total cost of ownership. Read this white paper to learn about the total cost of ownership (TCO) for the Dell PowerEdge servers.
Posted: 17 Nov 2010 | Published: 19 Mar 2009

Dell, Inc. and Intel®

PowerEdge M1000e Blade Chassis
sponsored by Dell, Inc. and Intel®
WHITE PAPER: Check out this concise white paper to find out the key features of this blade chassis that will help you construct your IT infrastructure, as well as a complete list of its technical specifications.
Posted: 19 Feb 2014 | Published: 31 Dec 2013

Dell, Inc. and Intel®

Understanding Desktop Virtualization
sponsored by Intel
WHITE PAPER: This white paper describes the variety of desktop virtualization models available, how each works, and the advantages and limitations of each model for key vectors such as security, manageability, and power consumption. Also identified are the major providers of software solutions and the end-point devices to deploy each model.
Posted: 14 Sep 2011 | Published: 13 Sep 2011

Intel